- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 26/02 - Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
Patent holdings for IPC class B23K 26/02
Total number of patents in this class: 520
10-year publication summary
44
|
29
|
36
|
51
|
35
|
34
|
26
|
17
|
13
|
4
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Disco Corporation | 1745 |
27 |
TRUMPF Werkzeugmaschinen GmbH + Co. KG | 585 |
16 |
IPG Photonics Corporation | 494 |
12 |
Mitsubishi Electric Corporation | 43934 |
11 |
FANUC Corporation | 5803 |
11 |
Samsung Display Co., Ltd. | 30585 |
10 |
Electro Scientific Industries, Inc. | 416 |
10 |
Hamamatsu Photonics K.K. | 4161 |
9 |
Amada Holdings Co., Ltd. | 297 |
7 |
Robert Bosch GmbH | 40953 |
6 |
Nikon Corporation | 7162 |
6 |
Precitec KG | 24 |
6 |
Scansonic MI GmbH | 37 |
6 |
Applied Materials, Inc. | 16587 |
5 |
Corning Incorporated | 9932 |
5 |
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V. | 4569 |
5 |
EO Technics Co., Ltd. | 96 |
5 |
Precitec ITM GmbH | 14 |
5 |
General Electric Company | 18133 |
4 |
Siemens AG | 24990 |
4 |
Other owners | 350 |